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How to complete the BQB testing of dual-mode Bluetooth chip or Bluetooth protocol? Deeplight tells you! (Guide article)


Bluetooth chip, as a key component in the upstream of Bluetooth industry chain, is directly related to the interoperability and consistency of Bluetooth downstream products. SIG has special testing standards and specifications to define these tests.


Taking the Bluetooth dual-mode chip project completed by Deeplight as an example, there are two parts in general:


1.Confirmation certification type:


Before the project starts, know the specifications supported by your products and determine the certification type. Chip manufacturers generally choose Basic certification types, usually component, host subsystem and controller subsystem.


There are generally five certification types related to products. A few chip manufacturers will choose end product to complete the whole project, while downstream finished product companies mainly focus on end product.


(1) End Product


Support at least one complete core architecture with corresponding Controller and Host core configuration, and optional service or profile specifications in addition to the core specifications.



Bluetooth architecture

IAL: Isochronous Adaptation Layer is the new protocol core layer of Bluetooth 5.2 version.

If the product needs LE Audio, this layer is a mandatory requirement.


(2) Controller Subsystem


Supports "half" core architecture with corresponding Controller core configuration. The Controller Subsystem must finally be combined with a complementary Host Subsystem to form a complete Bluetooth system (for example, tablet + operating system, etc.).


(3) Host Subsystem


Supports "half" core architecture with corresponding Host core configuration, and can select protocol stack/service/application specifications in addition to the core specifications. The Host Subsystem must eventually be combined with a complementary Controller Subsystem to form a complete Bluetooth system.


(4) Profile Subsystem


Support at least one or more Bluetooth services or all mandatory requirements defined in the Profile.


(5) Component


Support at least one or more layers of core specifications and or protocol stacks, all mandatory requirements in Service or Profile specifications. The purpose of the component is to be integrated to create a new End Product QDID or to allow further integration (for example, modify the circuit, modify the layout, modify the PCB) to create a new design.




2. The BQB testing process of the Bluetooth dual-mode chip is as follows:


(1) Declare the product basic information (Project Basics)


Fill in the basic information of the product, such as product name, model, trademark, certification type, product host and controller configuration, the configuration needs to declare whether it is single-mode or dual-mode, and is defined by BR/EDR/HS/LE.


(2) Layer Selection


The protocol layer contained in the product. For example, BR\EDR+LE dual-mode Bluetooth will involve common layers:


BB (Baseband Conformance), Link Manager,


L2CAP (Logical Link Control and Adaption Protocol),


HCI/4.0HCI (Host Controller Interface), LL (Low Energy Link Layer),


IAL (Isochronous Adaptation Layer), GATT (Generic Attribute Profile), ATT (Attribute Protocol)



Screenshot of core protocol layer selection


(3)ICS Selection


For the selection of specific functions pics in the protocol layer, check the specific supported functions for each layer. There are mandatory and optional functions. Mandatory functions are basic functions and must be supported. Selective functions are extensible. The more selective functions, the more test cases, which can better reflect the advantages of the product.


Screenshot of pics selection of specific functions in protocol layer


(4) Testing


This part is the key and time-consuming part of the whole process. It mainly tests the testplan generated after the protocol layer is defined. It will contain many test cases of the protocol layer, test and debug again and again, and check the signaling and process according to the test specifications.


The time of the whole project generally depends on two aspects: one is the speed of test and retest follow-up by the test engineer, and the other is the speed of debugging by the software engineer of the chip manufacturer. Only when the two sides cooperate closely can the project be completed quickly.


Normally, after receiving the chip sample, the test engineer will conduct the first round of full coverage test for all protocol layers, then screen the cases on the testplan, mark the passed test in green and the failed test in red, and send the test log to the software engineer of the chip manufacturer, After debugging, the testing engineer of Deeplight retests the specific test failure cases, and proceed accordingly.



screenshot of test of BR\EDR Baseband protocol in core layer controller



screenshot of test BR\EDR Link Manager in core layer controller



Screenshot of Link Layer protocol test in BLE core layer controller


(5) Review & product declaration


This step means that all tests have been completed. If it is R&D test or verification test, the project can be ended.


If the certification is to be completed, then purchase a DID, submit all data related to the test and encrypt the test log, state the product model, name, software and hardware version number, etc., and submit it to SIG for review. SIG will look at the test data and review it. If there is no problem, it will be listed on the website of SIG.


Deeplight as a senior technical service provider has assisted many chip manufacturers to complete the testing of Bluetooth single-mode and dual-mode BR\EDR\BLE chips, become one of the few teams in the market that can provide relevant technical services. Welcome to consult us.


This article is a summary of the actual project experience of the original articles, welcome to reprint and explain the source of Deeplight.

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